Automotive Module Series Figure 42: Top and Bottom Views of the Module ..................................................................................... 126 Figure 43: Recommended Reflow Soldering Thermal Profile ................................................................. 128 Figure 44: Carrier Tape Dimension Drawing ............................................................................................ 130 Figure 45: Plastic Reel Dimension Drawing ............................................................................................ 130 Figure 46:
Mounting Direction .................................................................................................................. 131 Figure 47: Packaging Process ................................................................................................................. 132 AG568N_Series_QuecOpen_Hardware_Design 13 / 135