Downloaded from https://www.everyspec.com MIL-STD-81OD 19 July 1983 test continued from the point where the test tolerances were exceeded. ~ 1 11-2.1 ~. Before initiating any testing, determine the required test conditions (see I-3.2). 11-2.2 ~. The salt used for thik.test shall be sodium chloride containing (on a dry basis) not more than 0.1 percent sodium iodide and not more than 0.5 percent total impurities. Unless Otherwise specified, a 5 ~ 1 percent solution shall be prepared by dissOlvinS 5’Parts by weight of salt in 95 parts by weight of water.
The solution shall be adjuated to, and maintained at, a specific gravity (figure 509.2-3) by using .the measured temperature and density of the salt solution. Sodium tetraborate (borax) may be added to the salt solution as a PH stabilization agent in a .- ratio not to exceed 0.7g sodium tetraborate to 7’5liters of salt solution. The PH of the salt solution, as collected as fallout in the exposure chamber, shall’be maintained between 6.5 and 7.2 with the ,aolutiontemperature at +35° C (+95°F) . Only diluted chemically pure hydrochloric acid or chemically pure sodium hydroxide shall be used to adjust the PH. The pH measurement shall be. ade electrometrically or calorimetrically. II-2.3 ~.
Unless the chamber haa been ueed within 5 days, immediately before the test, and wi,ththe exposure chamber empty, adjust a“lltest parameter to those required for the teat. Maintain these conditions for one 24-hour period. Continuously monitor all test parameters to verify that the test chamber is operating properly. * II-2.4 ~. All itema”require a Pretest checkout at room ambient conditions to provide baeeline data. Conduct the checkouts follows: Step 1. Prepare the test item in with General Requirements, 4.5.2. its required configuration in accordance Step 2. Record the room ambient conditions. Step 3. attention to: Conduct a complete visual examination of tbe test item with a.
High-streae areas. b. Areas where dissimilar metals are in contact. c. Electrical and electronic components - especially those having closely spaced, unpainted, or expoeed circuitry. I d. Metallic surfaces. MSTHOD 509.2 19 July 1983 509.2-8