The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes no responsibility for any inaccuracies that may be contained in this document, makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note: For the most up-to-date version of this manual, please see our web site at www.supermicro.com. SUPER MICRO COMPUTER reserves the right to make changes to the product described in this manual at any time and without notice.

This product, including software, if any, and documenta- tion may not, in whole or in part, be copied, photocopied, reproduced, translated or reduced to any medium or machine without prior written consent. IN NO EVENT WILL SUPER MICRO COMPUTER BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

IN PARTICULAR, SUPER MICRO COMPUTER SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA. Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Super Micro's total liability for all claims will not exceed the price paid for the hardware product. FCC Statement:

This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate” WARNING: Handling of lead solder materials used in this product may expose you to lead, a chemical known to the State of California to cause birth defects and other reproductive harm. Manual Revision 1.0b Release Date: June 5, 2007 Unless you request and receive written permission from SUPER MICRO COMPUTER, you may not copy any part of this document. Information in this document is subject to change without notice.

Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders. Copyright © 2007 by SUPER MICRO COMPUTER INC. All rights reserved. Printed in the United States of America

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Preface Preface About This Manual This manual is written for system integrators, PC technicians and knowledgeable PC users. It provides information for the installation and use of the X6DLP-4G2/ X6DLP-EG2 motherboard. The X6DLP-4G2/X6DLP-EG2 supports single or dual Intel ® Sossaman dual core processors at a 667 MHz front side bus.

Based upon the Intel Sossaman processor, the X6DLP-4G2/X6DLP-EG2 supports dual processing, Intel Architecture with Dynamic Execution, Address/Data/Response Parity on the Front Side Bus, Advanced Power Management, Intel Thermal Management, Enhanced Intel SpeedStep Technology (EIST), and is ideal for high performance, and low power communications infrastructure environments. Please refer to the motherboard speciﬁ cations pages on our web site (http://www.supermicro.com/products/ motherboard/) for updates on supported processors. This product is intended to be professionally installed.

Manual Organization Chapter 1 describes the features, speciﬁ cations and performance of the mother- board and provides detailed information about the chipset. Chapter 2 provides hardware installation instructions. Read this chapter when installing the processor, memory modules and other hardware components into the system. If you encounter any problems, see Chapter 3 , which describes troubleshooting procedures for the video, the memory and the system setup stored in CMOS. Chapter 4 includes an introduction to BIOS and provides detailed information on running the CMOS Setup utility. Appendix A provides BIOS POST Messages. Appendix B lists BIOS POST Codes.

Appendix C lists Software Installation Instructions. Conventions Used in this Manual Special attention should be given to the following symbols for proper installation and to prevent damage done to the components or injury to yourself: Danger/Caution: Instructions to be strictly followed to prevent catastrophic system failure or to avoid bodily injury. Warning: Important information given to ensure proper system installation or to prevent damage to the components. *Note: Additional Information given to differentiate various models or to ensure correct system setup. iii

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X6DLP-4G2/X6DLP-EG2 User's Manual Table of Contents Preface About This Manual ...................................................................................................... iii Manual Organization ................................................................................................... iii Conventions Used in this Manual .............................................................................. iii Chapter 1: Introduction 1-1 Overview ......................................................................................................... 1-1 Checklist ...................................................................................................

1-1 Contacting Supermicro ............................................................................. 1-2 X6DLP-4G2/X6DLP-EG2 Image ............................................... 1-3 X6DLP-4G2/X6DLP-EG2 Layout ............................................... 1-4 X6DLP-4G2/X6DLP-EG2 Quick Reference .............................. 1-5 Motherboard Features ................................................................................ 1-6 Intel E7520 Chipset: System Block Diagram ........................................... 1-8 1-2 Chipset Overview ...........................................................................................

1-9 1-3 Special Features ........................................................................................... 1-10 Recovery from AC Power Loss .............................................................. 1-10 1-4 PC Health Monitoring ................................................................................... 1-10 1-5 ACPI Features .............................................................................................. 1-11 1-6 Power Supply ............................................................................................... 1-12 1-7 Super I/O ........................................................................................................

1-13 Chapter 2: Installation 2-1 Static-Sensitive Devices ................................................................................. 2-1 Precautions ................................................................................................ 2-1 Unpacking ................................................................................................ 2-1 2-2 Processor and Heatsink Installation ............................................................... 2-2 2-3 Installing DIMMs ............................................................................................. 2-6 2-4 Control Panel Connectors and IO Ports .........................................................

2-7 A. Back Panel Connectors/IO Ports .............................................................. 2-7 B. Front Control Panel ................................................................................... 2-8 C. Front Control Panel Pin Deﬁ nitions .......................................................... 2-9 NMI Button ............................................................................................... 2-9 Power LED ............................................................................................... 2-9 HDD LED ..............................................................................................

2-10 NIC1/NIC2 LED ..................................................................................... 2-10 Overheat/Fan Fail LED ......................................................................... 2-11 Power Fail LED .........................................................................................2-11 iv

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