I =.. I MIL-STD-81OD Downloaded from https://www.everyspec.com I 19 July 1983 (a) PVC formulations (e.g., those plasticized with fatty acid esters). (b) Certain polyurethanea (e.g., polyesters and some polyethers). (C) Plastics which contain organic fillers of laminating materials, (d) Paints and varnishes which contain susceptible constituents. b. ~k on materials. Damage to fungus~resistant materials results from indirect attack when:
(1) Fungal grcwth on surface deposits of dust, grease, perspiration, and other contaminants (which find their way onto equipment during manufacture or accumulate during service) causes damage to the underlying material, even though that material may be resistant to direct attack. (2) Metabolic waate products (i.e., organic acids) excreted by fungi cause corrosion of metala, etching of glass, or staining or degrading of plastics and other materials. (3) The products of fungal growth on adjacent materials which are susceptible to direct attack come in contact with the resistant materials. 1-2.2 ~. Physical interference can occur as follows: a. ~.
Damage to electrical or electronic systems may result from either direct or indirect attack. Fungal growth can form undesirable electrical conducting paths across insulating materials or may adversely affect the electrical characteristic of critically adjusted electronic circuits. b. ~cal svstema. Damage to optical systems results primarily from indirect attack. The fungal growth can adversely affect light transmission through the optical system, block delicate moving parta, and change nonwetting surfaces to wetting surfaces with resulting loss in performance. I-2.3 factu.
Fungal growth on equipment can cause physiological problems (e.g., allergies) or be ao esthetically unpleasant that the users will be reluctant to use the equipment. I-3 AND ~ NOTE: This test method should be applied at the end of the tailoring process described in section Q of this standard. METHOD 508.3. 19 July 1983 508.3-2