Special Applications FPD, Semiconductors, and Solar Cells Limited-reflective 58 page Through-beam This page Wafer Mapping E32-A04+E3NX-FA21 Mapping Characteristics (E32-A04, High-speed mode) Detection positions (mm) 2 wafers 10 mm 0 12-inch silicon wafer 150 mm 5 10 0 2500 5000 7500 9999 Thin-profile design enables easy mounting on robot arms. Digital value Wafer Mapping Easy to adjust optical axis. (Typical alignment error between mechanical and optical axes is only ±0.1°.) Reliably wafer detection, even when stacked closely together. Specifications Through-beam Fiber Units * The optical fiber is 2 m long on each side, so the sensing distance is 4,000 mm. Note 1.
The following mode names and response times apply to the modes given in the Sensing distance column. [E3X-ZV] GIGA: Giga-power mode (16 ms), HS: High-speed mode (250 μs), ST: Standard mode (1 ms), and SHS: Super-high-speed mode (50 μs) [E3NX-FA] GIGA: Giga-power mode (16 ms), HS: High-speed mode (250 μs), ST: Standard mode (1 ms), and SHS: Super-high-speed mode (30 μs) The values for the minimum sensing object are reference values that indicate values obtained in standard mode with the sensing distance and sensitivity set to the optimum values. The first value is for the E3X-ZV and the second value is for the E3NX-FA. The sensing distances for the E3NX-FA are values for E3NX-FA @ devices.
The distance for E3NX-FAH @ infrared models varies. The E3X-HD Series offers the same sensing distance as the E3X-ZV. 2. 3. 4.
60 Fiber Sensor Features Selection Guide Fiber Units Standard Installation Threaded Hex-shaped Cylindrical Saving Space Flat Sleeved Small Spot Improvements High Power Narrow view Beam BGS High Power Narrow view BGS Transparent Objects Retro- reflective Limited- reflective Chemical- Immunity resistant, Oil-resistant Environmental Bending Heat- resistant Bending Heat- resistant Area Detection Applications Liquid-level Vacuum FPD, Semi, Solar Liquid-level Vacuum FPD, Semi, Solar Installation Information Fiber Amplifiers, Communications Unit, and Accessories Technical Guide and Precautions Model Index 60 Detection Detection Application Ambient temperature Aperture angle Appearance (mm) Bending radius of cable Sensing distance (mm) Optical axis diameter (minimum sensing object) Models 61 Page Dimensions No.
E3X-ZV GIGA HS Other modes E3NX-FA GIGA HS Other modes Wafer Mapping 70°C 1.5° 3.4° 20.5 Thickness: 3 mm IP50 Flexible, R1 3,220 1,200 ST : 1,780 SHS: 500 4,000 * 1,800 ST : 2,670 SHS: 500 2 dia. (0.1 dia./ 0.03 dia.) E32-A03 2M IP50 10 24.5 3 IP50 10 24.5 3 IP50 20.5 Thickness: 2 mm IP50 R10 E32-A03-1 2 R10 R10 2,500 940 1,280 450 ST : 1,400 SHS: 380 ST : 680 SHS: 200 2,500 940 1,920 670 ST : 1,400 SHS: 380 ST : 1,020 SHS: 200 - 1.2 dia. (0.1 dia./ 0.03 dia.) E32-A03-2 2 E32-A04 2M IP50 9 21 1.2 IP50 R10 1,280 450 ST : 680 SHS: 200 1,920 670 ST : 1,020 SHS: 200 E32-A04-1 2 IP50 20.5 2 IP50 R10 960 335 ST : 510 SHS: 150 1,440 500 ST : 760 SHS: 150 - E32-A04-8 2 IP50 4° 20.5 3.5 dia.
IP50 Flexible, R1 4,000 * 1,460 ST : 2,200 SHS: 580 4,000 * 2,190 ST : 3,300 SHS: 580 2 dia. (0.1 dia./ 0.03 dia.) E32-T24SR 2 R10 4,000 * 1,740 ST : 2,600 SHS: 700 4,000 * 2,610 ST : 3,900 SHS: 700 E32-T24S 2 IP50