E32 A03 and E3X ZV Semiconductor Solution Guide 202403 (EN)

Wafer Mapping Precise detection of wafer to ensure proper loading of wafers into FOUP. Challenges: Key Features • Low cost & high performance amplifier • Optional version with bracket attached to fiber, no additional accessories required • Agile end effectors are required to load costly and delicate wafers into the FOUP, leaving little room to mounting sensors used to detect the presence of wafers. • Wafers thicknesses range from 300 micron to 0.5 mm, proving a challenge to reliably detect • As the demand for chips rise, manufacturers are challenged to reduce costs to produce while increasing efficiency. Why E32-A03 with E3X-ZV for Wafer Mapping?

• The fiber optic head E32-A03 requires a small footprint on the end effector with dimensions of just 20.5mm length and 3 mm diameter • E32-A03 has a 0.1 mm minimum detectable object size and 1.5° aperture angle specification, detecting thin wafers with ease. • The E3X-ZV/MZV Omron’s low cost, high performance amplifier will help reduce manufacturing costs while maintaining advanced detection capabilities.

Scan or Click Me E32-A03 Thrubeam Fiber head, 2 m length, sideview no bracket, flexible cable E32-A03-1 Thrubeam Fiber head, 2 m length, sideview with brackets E3X-ZV11 2M Fiber Amplifier, 2 m cable, NPN, 1 output E3X-ZV41 2M Fiber Amplifier, 2 m cable, PNP, 1 output E3X-ZV6 Fiber Amplifier, wire-saving connector, NPN, 1 output E3X-ZV8 Fiber Amplifier, wire-saving connector, PNP, 1 output E3X-CN11 Connector Cable, 2 m ©2024 OMRON. All Rights Reserved. Note: Specifications are subject to change. OMRON Automation | 800.556.6766 | automation.omron.com Part Number Description

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