The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes no responsibility for any inaccuracies that may be contained in this document, makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note: For the most up-to-date version of this manual, please see our web site at www.supermicro.com. Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice.

This product, including software, if any, and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or reduced to any medium or machine without prior written consent. IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.

SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA. Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. SuperMicro's total liability for all claims will not exceed the price paid for the hardware product. FCC Statement:

This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate” WARNING: Handling of lead solder materials used in this product may expose you to lead, a chemical known to the State of California to cause birth defects and other reproductive harm. Manual Revision 1.1 Release Date: Oct. 16, 2008 Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this document.

Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders. Copyright © 2008 by Super Micro Computer, Inc. All rights reserved. Printed in the United States of America

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Preface Preface About This Manual This manual is written for system integrators, PC technicians and knowledgeable PC users. It provides information for the installation and use of the X7DBR-3/X7DBR-E motherboard. The X7DBR-3/X7DBR-E supports dual Intel X EON 64-bit dual core processors at a front side bus speed of 667 MHz/1.066 GHz/1.333 GHz. With dual 64-bit Xeon dual core processors, the 5000P chipset, and 8 DDR2 FBD 667/533 memory DIMM sockets built-in, the X7DBR-3/X7DBR-E offers substantial functionality and performance enhancements to the motherboards based on the NetBurst microarchitecture while remaining compatible with the 32-bit based software.

The features include the Intel Hyper- Threading Technology, Virtualization Technology, Hyper Pipelined Technology, Ex- ecution Trace Cache, Thermal Monitor 1/2 (TM1/TM2), Enhanced Intel SpeedStep technology, Advanced Dynamic Execution, Advanced Transfer Cache, Streaming SIMD Extensions 3 (SSE3) and Extended Memory 64 Technology (EM64T). These features allow the motherboard to operate at much higher speeds, with better power management and in much safer environments than traditional motherboards. The X7DBR-3/X7DBR-E is ideal for high performance dual processor (DP) enterprise server environments. This product is intended to be professionally installed.

Manual Organization Chapter 1 describes the features, speciﬁ cations and performance of the mainboard and provides detailed information about the chipset. Chapter 2 provides hardware installation instructions. Read this chapter when installing the processor, memory modules and other hardware components into the system. If you encounter any problems, see Chapter 3 , which describes troubleshooting procedures for the video, the memory and the system setup stored in CMOS. Chapter 4 includes an introduction to BIOS and provides detailed information on running the CMOS Setup utility. Appendix A and Appendix B provide BIOS POST Messages and POST Codes.

Appendix C, Appendix D and Appendix E list HostRAID Setup Guidelines and Other Software Driver and Program Installation Instructions. Conventions Used in the Manual: Special attention should be given to the following symbols for proper installation and to prevent damage done to the components or injury to yourself: Danger/Caution: Instructions to be strictly followed to prevent catastrophic system failure or to avoid bodily injury. Warning: Important information given to ensure proper system installation or to prevent damage to the components. *Note: Additional Information given to differentiate various models or to ensure correct system setup. iii

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X7DBR-3/X7DBR-E User's Manual Table of Contents Preface About This Manual ...................................................................................................... iii Manual Organization ................................................................................................... iii Conventions Used in the Manual ..................................................................................iii Chapter 1: Introduction 1-1 Overview ......................................................................................................... 1-1 Checklist ...................................................................................................

1-1 Contacting Supermicro ............................................................................. 1-2 X7DBR-3/X7DBR-E Image ......................................................... 1-3 X7DBR-3/X7DBR-E Layout ........................................................ 1-4 Quick Reference ...................................................................................... 1-5 Motherboard Features ................................................................................ 1-6 1-2 Chipset Overview ........................................................................................... 1-9 Intel 5000P Chipset: System Block Diagram ...........................................

1-8 1-3 Special Features ........................................................................................... 1-10 Recovery from AC Power Loss .............................................................. 1-10 1-4 PC Health Monitoring .................................................................................... 1-10 1-5 ACPI Features .............................................................................................. 1-11 1-6 Power Supply ............................................................................................... 1-12 1-7 Super I/O ........................................................................................................

1-13 Chapter 2: Installation 2-1 Static-Sensitive Devices ................................................................................. 2-1 Precautions ................................................................................................ 2-1 Unpacking ................................................................................................ 2-1 2-2 Processor and Heatsink Installation ............................................................... 2-2 2-3 Installing DIMMs ............................................................................................. 2-6 2-4 Control Panel Connectors and IO Ports .........................................................

2-8 A. Back Panel Connectors/IO Ports .............................................................. 2-8 B. Front Control Panel ................................................................................... 2-9 C. Front Control Panel Pin Deﬁ nitions ........................................................ 2-10 NMI Button ............................................................................................. 2-10 Power LED ............................................................................................. 2-10 HDD LED ..............................................................................................

2-11 NIC1/NIC2 LEDs ................................................................................... 2-11 Overheat/Fan Fail LED ......................................................................... 2-12 Power Fail LED ........................................................................................ 2-12 iv

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